Branzei, Mihai: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Thermal Investigations on Modules Realized Using Solderless Assembly for Electronics Technology

Ionescu, Ciprian, Branzei, Mihai, Codreanu, Norocel, Varzaru, Gaudentiu

Year:

2019

Language:

english

File:

PDF, 1.06 MB

english, 2019

2

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature

Branzei, Mihai, Svasta, Paul Mugur, Vladescu, Marian, Plotog, Ioan, Mihailescu, Bogdan, Varzaru, Gaudentiu

Year:

2019

Language:

english

File:

PDF, 1.28 MB

english, 2019

3

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Solder joints properties as function of multiple reflow Vapor Phase Soldering process

Branzei, Mihai, Plotog, Ioan, Miculescu, Florin, Varzaru, Gaudentiu, Svasta, Paul, Thumm, Andreas

Year:

2012

Language:

english

File:

PDF, 374 KB

english, 2012

4

Influence of high temperature exposure on the adhesion of a micro-composite refractory enamel to a Ni–18Cr–12W superalloy

Branzei, Mihai, Pencea, Ion, Matei, Alecs Andrei, Sfat, Catalin Eugen, Antoniac, Iulian Vasile, Turcu, Ramona Nicoleta, Manoliu, Victor

Journal:

Journal of Adhesion Science and Technology

Year:

2017

Language:

english

File:

PDF, 3.35 MB

english, 2017

5

A Model of Optimization and Control the Thermite Kit for Aluminothermic Welding

Branzei, Mihai, Cojocaru, Mihai Ovidiu, Coman, Tudor Adrian, Vascan, Ovidiu

Journal:

Solid State Phenomena

Year:

2016

Language:

english

File:

PDF, 348 KB

english, 2016

6

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - PCBs thermophysical properties in lead-free assembling process assessment

Plotog, Ioan, Branzei, Mihai, Svasta, Paul, Miculescu, Marian, Cucu, Traian, Thumm, A.

Year:

2010

Language:

english

File:

PDF, 314 KB

english, 2010

7

A Study on Metal-Ceramic Thermal Expansion Compatibility

Miculescu, Marian, Brânzei, Mihai, Miculescu, Florin, Meghea, Daniela, Bane, Marin

Journal:

Solid State Phenomena

Year:

2014

Language:

english

File:

PDF, 417 KB

english, 2014

8

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Multiconvolutional approach for uncertainty estimation of the thermal diffusivity measured by flash method

Pencea, Ion, Plotog, Ioan, Branzei, Mihai, Bibis, Adrian, Svasta, Paul

Year:

2013

Language:

english

File:

PDF, 302 KB

english, 2013

9

Low Rigidity Ti-Nb-Ta-X (X=Cr, Zr, Ag, In) Alloys with Improved Properties

Journal:

Key Engineering Materials

Year:

2016

Language:

english

File:

PDF, 991 KB

english, 2016

10

Physical and Quantitative Microstructural Analysis of Sintered Al-Cu/SiCp Composites

Popescu, Ileana Nicoleta, Zamfir, Simona, Bojin, Dionezie, Brânzei, Mihai, Gheorghe, Dan, Sorcoi, Lidia Adriana

Journal:

Materials Science Forum

Year:

2011

Language:

english

File:

PDF, 696 KB

english, 2011

11

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model

Plotog, Ioan, Mihailescu, Bogdan, Pencea, Ioan, Branzei, Mihai, Svasta, Paul, Cucu, Traian, Tarcolea, Mihai

Year:

2011

Language:

english

File:

PDF, 769 KB

english, 2011

12

[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Solder joints properties assessment in the terms of 4P Soldering Model

Plotog, Ioan, Cucu, Traian, Mihailescu, Bogdan, Svasta, Paul, Branzei, Mihai, Tarcolea, Mihai, Miculescu, Florin, Thumm, Andreas, Flechtmann, Andreas

Year:

2011

Language:

english

File:

PDF, 1.18 MB

english, 2011

13

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Investigation on thermal properties of substrates for printed electronics

Ionescu, Ciprian, Bonfert, Detlef, Branzei, Mihai

Year:

2014

Language:

english

File:

PDF, 685 KB

english, 2014

14

[IEEE 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cluj-Napoca, Romania (2019.10.23-2019.10.26)] 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Electrically Conductive Paste Printed Volume Influence on Bonds Properties

Branzei, Mihai, Varzaru, Gaudentiu, Vladescu, Marian, Mihailescu, Bogdan, Plotog, Ioan

Year:

2019

File:

PDF, 4.45 MB

2019

15

Complex Characterization of a New Low Ni Maraging Steel with Enhance Service Stability

Brânzei, Mihai, Nedelcu, Ion, Miculescu, Marian

Journal:

Solid State Phenomena

Year:

2012

Language:

english

File:

PDF, 2.38 MB

english, 2012

16

[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - The mischmetal and Bi94Zn6 effect alloying on SACX 0307

Branzei, Mihai, Pencea, Ion, Plotog, Ioan, Miculescu, Florin, Cristea, Ionut, Thumm, Andreas

Year:

2013

Language:

english

File:

PDF, 1009 KB

english, 2013

17

Implant Surface Finishing Influence on Tissue-Implant Anchoring

Miculescu, Florin, Ciocan, Lucian Toma, Miculescu, Marian, Meghea, Daniela, Bane, Marin, Brânzei, Mihai

Journal:

Solid State Phenomena

Year:

2014

Language:

english

File:

PDF, 2.90 MB

english, 2014

18

[IEEE 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Galati, Romania (2013.10.24-2013.10.27)] 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Lead/Lead Free solder joints comparative shear tests function of working temperature and soldering thermal profile

Plotog, Ioan, Varzaru, Gaudentiu, Mihailescu, Bogdan, Branzei, Mihai, Bibis, Adrian, Cristea, Ionut

Year:

2013

Language:

english

File:

PDF, 629 KB

english, 2013

19

[IEEE 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Bucharest, Romania (2014.10.23-2014.10.26)] 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Studies on thermal properties of substrates for electronics using IR thermography

Ionescu, Ciprian, Branzei, Mihai, Mihailescu, Bogdan, Bonfert, Detlef

Year:

2014

Language:

english

File:

PDF, 422 KB

english, 2014

20

[IEEE 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Pitesti, Romania (2010.09.23-2010.09.26)] 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Low silver, lead free solder paste, new alloy developments

Cucu, Traian C., Plotog, Ioan, Svasta, Paul, Branzei, Mihai

Year:

2010

Language:

english

File:

PDF, 235 KB

english, 2010

21

Thermodynamics of Iron Metallothermy

Cojocaru, Mihai Ovidiu, Branzei, Mihai, Coman, Tudor

Journal:

Advanced Materials Research

Year:

2015

Language:

english

File:

PDF, 267 KB

english, 2015

22

[IEEE 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Eger, Hungary (2015.5.6-2015.5.10)] 2015 38th International Spring Seminar on Electronics Technology (ISSE) - Shear strength function of temperature for lead/lead-free alloys samples obtained with different cooling rate

Branzei, Mihai, Varzaru, Gaudentiu, Svasta, Paul Mugurel

Year:

2015

Language:

english

File:

PDF, 1.21 MB

english, 2015

23

[IEEE 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Brasov, Romania (2015.10.22-2015.10.25)] 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Aspects on thermophisycal properties of interconnection structures for power LEDs applications

Branzei, Mihai, Vladescu, Marian

Year:

2015

Language:

english

File:

PDF, 518 KB

english, 2015

24

SPIE Proceedings [SPIE Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2016 - Constanta, Romania (Thursday 25 August 2016)] Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VIII - Comparative shear tests of some low temperature lead-free solder pastes

Vladescu, Marian, Tamas, Razvan, Cristea, Ionica, Branzei, Mihai, Plotog, Ioan, Varzaru, Gaudentiu, Cucu, Traian C.

Year:

2016

Language:

english

File:

PDF, 885 KB

english, 2016

25

Correlation between Microstructure and Magnetic Properties on MnZn Ferrite with Bi2O3 Increasing Addition

Brânzei, Mihai, Cristea, Ionut, Ciucă, Ion, Bibiș, Adrian, Feder, Marcel

Journal:

Solid State Phenomena

Year:

2014

Language:

english

File:

PDF, 3.34 MB

english, 2014

26

Thermophysical Properties in Assembling Process at Macro and Micro Level

Branzei, Mihai, Plotog, Ioan

Journal:

Advanced Materials Research

Year:

2015

Language:

english

File:

PDF, 1007 KB

english, 2015

27

[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Comparative shear tests of two low melting point solder pastes relating to their thermal diffusivity

Branzei, Mihai, Vladescu, Marian, Plotog, Ioan, Cucu, Traian

Year:

2017

Language:

english

File:

PDF, 743 KB

english, 2017

28

[IEEE 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Zlatibor, Serbia (2018.5.16-2018.5.20)] 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Properties Investigations on Copper Based Printed Conductive Pastes Electrical Joints

Branzei, Mihai, Ionescu, Ciprian, Plotog, Ioan, Varzaru, Gaudentiu

Year:

2018

Language:

english

File:

PDF, 1.21 MB

english, 2018

29

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature

Branzei, Mihai, Svasta, Paul Mugur, Vladescu, Marian, Plotog, Ioan, Mihailescu, Bogdan, Varzaru, Gaudentiu

Year:

2019

File:

PDF, 1.28 MB

2019

30

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Lead/lead-free solder alloys shear tests correlations with structure at different temperatures

Branzei, Mihai, Mihailescu, Bogdan, Pencea, Ion

Year:

2014

Language:

english

File:

PDF, 432 KB

english, 2014

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски